Understand the information being transferred
Ucamco's Gerber X2 description explains attributes for layer and feature meaning. Siemens describes ODB++ as a structured design through manufacturing exchange, while IPC describes IPC-2581 as an XML based manufacturing description. These are information models, not guarantees that every export contains every requirement.
List the information your board needs: copper, mask, profile, drill spans, net connectivity, stackup, impedance intent and assembly data if applicable. Check how the chosen exporter and importer represent each item.
Select a workflow both sides can verify
Ask the supplier which formats and versions its actual CAM workflow accepts. Then generate a representative test export early, especially for uncommon layer structures or special features. A format supported by a CAD menu is not automatically supported identically by every downstream system.
Choose one authoritative release package. If a secondary format is supplied for convenience, label its role and generate it from the same design state. Two unmarked archives create uncertainty when their contents differ.
Check semantics as well as pictures
A viewer can reveal misplaced holes and incorrect profiles, but a visually plausible image may still have incorrect layer order or feature attributes. Compare the imported layer map, net information and drilling spans with the approved construction. Ask the receiving engineer to identify any lost or reinterpreted information.
| Review question | Required outcome |
|---|---|
| Which archive is authoritative? | One revision identified clearly |
| Are drill spans preserved? | Layer pairs match the approved map |
| Are special requirements represented? | Digital attributes or explicit referenced notes |
| Can both parties inspect it? | Agreed viewer and import checks |
Make revisions complete and reproducible
Store export settings, tool version and a manifest with the released files. Regenerate a complete package after an approved design change. Avoid combining individually emailed replacements with older files, particularly when a stackup or via span changes.
When a supplier reports an import problem, capture the exact feature and interpretation. Fix the source or agreed export process and reissue the package. This resolves the cause and makes the next order repeatable.
Adjacent-layer access, one connection at a time
Dielectric · geometry + material
Core or build-up dielectric
Illustrative only. Copper thickness, dielectric construction and via spans require a reviewed stackup.
Common questions
Is an intelligent format always better than Gerber?
It may preserve more integrated information, but successful handoff depends on exporter quality, importer support and verification. Use a workflow that both parties can inspect.
Should I send all three formats?
Only when there is a clear reason and defined precedence. Extra formats can help review, but inconsistent parallel releases create more ambiguity than they remove.
References & further reading
Method & assumptions · General design guidance. Validate the proposed construction and acceptance criteria for your project.