Design / EXPLORE THE LIBRARY
HDI PCB Design Guides
Compare architectures, plan BGA escape and define interconnect geometry before routing the entire board. Layer count, via access and reference planes must be considered together. A configuration label alone does not tell you whether the pin field will escape.
Make the stackup work for the layout.
Use the stackup explorer to establish possible transitions, the BGA tool to check simple channels, and the DFM checklist to capture the decisions that need fabrication approval. Each guide focuses on a different design decision.
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ELIC vs Conventional HDI: Compare Reachable Routing Space
Compare any-layer ELIC and conventional HDI through required layer access, package escape, manufacturing complexity, and verification.
02 / DesignHDI vs Standard PCB: Test the Escape Before Choosing
Compare conventional and HDI PCB approaches using package escape, reference planes, board area, and manufacturing requirements.
03 / DesignStacked vs Staggered Microvias: Trade Footprint for Routing Freedom
Compare stacked and staggered microvia paths through area, intermediate routing, reference continuity, and representative reliability evidence.
04 / DesignBlind vs Buried Vias: Define Access and Construction Separately
Understand blind and buried via terminology, then map each connection to a practical manufacturing sequence and layout rule.
05 / DesignMicrovia Aspect Ratio: Calculate It with Agreed Dimensions
Use depth-to-diameter ratio as an HDI screening calculation while checking measurement convention, taper, tolerances, and process approval.
06 / Design1+N+1 HDI Stackup: Make One Build-Up Level Count
Plan a 1+N+1 HDI stack around first-level escape, central routing access, reference continuity, and a complete via map.
07 / Design2+N+2 HDI Stackup: Plan the Intermediate Layer
Design a two-level HDI build-up with explicit stacked or staggered transitions, intermediate routing, and central structure access.
08 / Design3+N+3 HDI Stackup: Justify the Third Access Level
Review a three-level HDI build-up through complete escape paths, interface combinations, reference changes, and qualification scope.
09 / DesignAny-Layer Stackup: Design a Network of Legal Transitions
Plan an any-layer stack with explicit transition paths, reference roles, material constraints, and controlled CAD definitions.
10 / Design6-Layer HDI Stackup: Protect the Reference Budget
Evaluate a six-layer HDI board through limited plane capacity, package escape, power distribution, and central-layer access.
11 / Design8-Layer HDI Stackup: Choose Access Depth or Central Capacity
Compare eight-layer HDI architectures by build-up depth, central routing resources, escape constraints, and reference continuity.
12 / Design10-Layer HDI Stackup: Organize Interface and Power Domains
Plan ten-layer HDI by assigning interface routes, reference layers, power distribution, and construction-specific transitions.
13 / Design12-Layer HDI Stackup: Control Complexity by Functional Region
Review a twelve-layer HDI design through functional routing budgets, interconnect combinations, materials, and verification scope.
14 / DesignStackup Symmetry: Review Materials, Copper, and Pattern Together
Evaluate PCB stack symmetry beyond layer count, including dielectric construction, copper thickness, material pairing, and local pattern balance.
15 / DesignSkip Microvias: Review the Full Depth and Intermediate Layer
Evaluate skip microvias as specific manufactured structures, including depth, intermediate copper, target geometry, and alternatives.
16 / DesignHDI Design Rules: Encode the Approved Construction
Build HDI CAD constraints around layer pairs, copper construction, complete via combinations, local exceptions, and release checks.
17 / DesignPads and Antipads: Balance Landing Margin and Plane Continuity
Select HDI capture pads, target lands, and antipads using manufacturing margin, electrical clearance, routing space, and reference behavior.
18 / DesignCopper Balance: Review Local Density Without Disturbing the Circuit
Assess copper distribution across HDI layers and regions, then coordinate balancing changes with electrical and manufacturing requirements.
19 / DesignBGA Fanout: Prove the Escape Before Choosing the HDI Stack
Plan package escape by signal groups, routing corridors, via access, references, and power connections before committing layer count.
20 / Design0.4 mm BGA Escape: Budget Every Pad, Opening, and Clearance
Evaluate 0.4 mm pitch BGA fanout with exact package lands, tolerance-aware routing, via processing, and assembly review.
21 / Design0.5 mm BGA Escape: Compare Dogbone and Microvia Routes
Evaluate 0.5 mm BGA routing with package-specific pads, tolerance margins, via lands, references, and layer access.
22 / DesignSolder-Mask Clearance: Review Openings and Webs as Real Geometry
Set mask openings using package lands, registration, minimum webs, via treatment, and the final exported manufacturing layers.
23 / DesignThermal Vias: Connect Heat to a Useful Spreading Structure
Design thermal via arrays with package electrical requirements, copper spreading, solder control, and system cooling in view.
24 / DesignHDI DFM Review: Close the Gaps Between CAD and the Proposed Build
Review the stackup, via sequence, escape geometry, mask, electrical requirements, and release data as one HDI manufacturing definition.