Materials / EXPLORE THE LIBRARY
Materials for HDI PCB Design
Material selection combines electrical loss, thermal behavior, dimensional stability and compatibility with the proposed fabrication sequence. Use construction-specific data and the intended test conditions when comparing candidate systems.
Match the material to the channel and the process.
Start with Dk and Df if you are building a channel model. Start with expansion and moisture if qualification is the concern. For a replacement material, review the whole construction and revalidate the affected assumptions.
Explore materials
FR-4 for HDI PCBs: Select a Construction, Not Just a Grade
Choose FR-4 for HDI using the build-up geometry, reflow exposure, channel loss, and verified construction data.
02 / MaterialsHigh-Tg FR-4: What It Does and What It Does Not Establish
Use Tg alongside expansion, decomposition, assembly exposure, and interconnect validation when selecting HDI materials.
03 / MaterialsLow-Loss Laminates for HDI: Spend the Channel Budget Deliberately
Compare low-loss PCB materials using channel length, copper profile, geometry, and a consistent simulation basis.
04 / MaterialsDk and Df: Use the Values That Match the PCB Model
Interpret dielectric constant and loss tangent with frequency, test method, glass construction, and modeling purpose.
05 / MaterialsGlass Weave and Differential Skew in HDI Routing
Review glass construction, route orientation, and channel symmetry before treating geometric length matching as timing closure.
06 / MaterialsCopper Roughness: A Material Choice Inside the Loss Model
Specify copper profile and treatment together with dielectric properties when evaluating high-speed HDI channels.
07 / MaterialsCTE and Z-Axis Expansion: Review the Whole Thermal Excursion
Relate laminate expansion to plated holes, microvia structures, and the real assembly and operating temperature history.
08 / MaterialsPrepreg Resin Content: Plan Fill, Thickness, and Electrical Behavior
Review prepreg resin content with copper distribution, pressed thickness, glass construction, and impedance requirements.
09 / MaterialsLaser-Drillable Dielectrics: Define the Complete Microvia Process
Evaluate build-up dielectrics through laser opening, cleaning, metallization, and final via geometry rather than a label.
10 / MaterialsHalogen-Free PCB Materials: Specify Chemistry and Performance Separately
Select a declared halogen-free laminate while preserving HDI construction, electrical behavior, and assembly requirements.
11 / MaterialsIsola I-Speed for HDI: Construction and Release Checklist
Evaluate I-Speed laminate and prepreg using construction tables, copper options, channel models, and process evidence.
12 / MaterialsIsola I-Tera MT40: Review the Exact Laminate and Bonding Build
Plan an I-Tera MT40 HDI stackup with construction-specific electrical data and explicit processing review.
13 / MaterialsPanasonic MEGTRON: Specify the Series, Grade, and Copper
Choose a MEGTRON construction with the exact product designation, dielectric build, copper option, and channel requirement.
14 / MaterialsRogers Hybrid Stackups: Control the Interfaces Between Materials
Evaluate a Rogers hybrid PCB through field distribution, bonding compatibility, symmetry, and the actual build-up sequence.
15 / MaterialsPCB Material Substitution: Approve the Changed Construction
Use an engineering change checklist for laminate substitutions covering impedance, loss, geometry, processing, and evidence.
16 / MaterialsMoisture and Storage: Preserve the State of Materials and Bare Boards
Separate prepreg handling from finished-board storage and keep moisture exposure tied to the correct material instructions.